I/O Design
Connect the chip to the outside world safely and reliably.
Overview
I/O design defines pad placement, signal ordering, ESD protection, and package constraints. It sets the boundary between the die and the system board.
A clean IO strategy reduces noise, improves signal integrity, and simplifies routing.
Key Considerations
Group related signals and separate noisy IOs from sensitive analog or clock pins.
Plan robust power and ground pads to support current demand and reduce IR drop.
Ensure ESD structures meet foundry and reliability requirements.
Checklist
Define pad ring early with package team input.
Reserve keepout regions for critical IOs and test pins.
Validate IO placement against routing congestion.